H05K3/0026- Etching of the substrate by chemical or physical means by laser ablation.H05K3/0017- Etching of the substrate by chemical or physical means.H05K3/0011- Working of insulating substrates or insulating layers.H05K1/186- Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding.H05K1/185- Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit.
H05K1/182- Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g.H05K1/18- Printed circuits structurally associated with non-printed electric components.H05K3/4697- Manufacturing multilayer circuits having cavities, e.g.H05K3/46- Manufacturing multilayer circuits.H05K3/00- Apparatus or processes for manufacturing printed circuits.H05K- PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS.
Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Priority to KR1020100013438A priority Critical patent/KR20110093407A/en Priority to KR10-2010-0013438 priority Priority to KR1020100050675A priority patent/KR101136396B1/en Priority to KR10-2010-0050675 priority Application filed by Lg Innotek Co., Ltd. Priority date (The priority date is an assumption and is not a legal conclusion. ( en Inventor Hyung Jong Kim Jae Hyoun Yoo Jin Goo Chun Jun Soo Park Ki Yong Lee Original Assignee Lg Innotek Co., Ltd. Google Patents WO2011099820A3 - Pcb with cavity and fabricating method thereof WO2011099820A3 - Pcb with cavity and fabricating method thereof
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